MECHANIC 138°C Lead-Free Solder Paste – Precision Low Temp Alloy for Micro Soldering

Product Overview:

Upgrade your soldering performance with the MECHANIC 138°C Lead-Free Solder Paste, a high-precision, low-temperature solution specially engineered for micro soldering, SMD, BGA, and heat-sensitive electronics repairs. Designed with cutting-edge alloy formulation, this solder paste melts at just 138°C, reducing the risk of heat damage to delicate components while delivering flawless connectivity and strong joints.

Whether you're repairing smartphone motherboards, fine-pitch ICs, or sensitive medical electronics, this paste guarantees clean solder flow, minimal residue, and excellent electrical conductivity. Its lead-free composition makes it a safer choice for both users and the environment, aligning with modern RoHS compliance standards.

Key Features & Benefits:

• ?️ Low Melting Point (138°C): Ideal for temperature-sensitive devices and components

• ? 100% Lead-Free & RoHS Compliant: Eco-conscious formulation for safe use

• ? High-Precision Alloy Blend: Ensures strong solder joints and minimal bridging

• ? Clean Residue Formula: Leaves minimal cleanup with clear, stable connections

• ? Excellent Wetting Performance: Smooth solder flow even on oxidized surfaces

• ⚡ Great for SMD/BGA/IC Repairs: Specially made for intricate electronics and tight spaces

• ?️ Professional-Grade Quality: Trusted by technicians and repair centers worldwide

Recommended For:

• Mobile phone and tablet motherboard repairs

• Micro-soldering and surface mount technology (SMT) work

• BGA chip reballing and rework

• LED board soldering

• CPU/GPU component soldering

• DIY electronics and robotics projects

Product Specifications:

• Brand: MECHANIC

• Model: 138°C Low Temp Lead-Free Paste

• Melting Point: 138°C (280°F)

• Form: Paste

• Composition: Lead-free alloy (Sn-Bi based)

• Particle Size: 25–45μm

• Net Weight: 50g

• Shelf Life: 6–12 months (store in a cool environment)